MODELING AND SIMULATION OF ION IMPLANTATION AND ELECTRICAL DISCHARGE DEPOSITION

Abstract

This paper deals with the modelling and simulation of an ion implantation installation and deposition of microstructures on an Aluminum 7075 plate. COMSOL Multiphysics was used to study the ion implantation process on surface of the sample. Within an ion implanter, ions generated within thermo emissive cathode are accelerated by an electric field to achieve the desired implant energy. The energy dose and angle of the ion incident beam are both key parameters for the process. By changing the placement angle of the plate incrementally by five degrees, the number density, the variation of the molecular flux and the pressure were simulated. It was approached another related process involving ion deposition – electrical discharge deposition (EDD) – based on modeling and simulation of the process through mentioned above dedicated software. The process parameters were determined aiming at material deposition on the sample and keeping under control the deposition dimensions.